BS 3934-3:1992
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Mechanical standardization of semiconductor devices Recommendations for the preparation of outline drawings of integrated circuits
Hardcopy , PDF
15-06-2000
English
01-04-1992
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Committees responsible
Foreword
Recommendations
1. Scope
2. Terminology and definitions
3. Cross-referencing of packages
4. Terminal identification - Numbering of terminals
5. Dimensions and reference letter symbols
6. Drawing layout
7. Dimensioning and tolerances
8. Inter-conversion of inch and millimetre dimensions
and rules for rounding off
9. Definitions of families
10. Examples of drawings
11. Design procedure for dimensions of integrated
circuit packages
12. Rules for mounting integrated circuit packages into
carriers
13. Bending of terminals of QUIL packages (packages of
a sub-family of Form 2)
14. Pin grid arrays
15. Rule for orientation of integrated circuit
packages in handling and shipping carriers such as
stick magazines and rails
Appendices
A. Limits applicable for the dimensions of integrated
circuits package outlines
B. Example drawings showing cross-referencing of
packages, utilization of reference letter symbols,
terminal identification and index area
C. Terminal identification and numbering of terminals
of devices with terminals disposed in three or more
rows in each orthogonal direction
D. Design procedure for dimensions of integrated circuit
packages of Form 2 Family
E. General rules for the preparation of outline drawings
of packages of Form G intended for automated handling
F. General rules for the preparation of outline drawings
of pin grid arrays
G. Rule for orientation of integrated circuit packages
in handling and shipped carriers such as stick
magazines and rails
Describes recommended practice for preparation of drawings of integrated circuit outlines. Includes sections on terminology and definitions, cross referencing of packages, terminal identification, dimensions and reference letter symbols, drawing layout, dimensioning and tolerances, and interconversion of inch and millimetre dimensions.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes BS 3934:ADD5(1983) (07/2004)
|
| DocumentType |
Standard
|
| Pages |
48
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| BS IEC 60747-10:1991 | Semiconductor devices Generic specification for discrete devices and integrated circuits |
| BS QC700000(1991) : 1991 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRIC COMPONENTS - GENERIC SPECIFICATION FOR DISCRETE DEVICES AND INTEGRATED CIRCUITS |
| BS 3934-6:1992 | Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages |
| IEC 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| ISO 2692:2014 | Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR) |
| ISO 1101:2017 | Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
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