BS 4584-103.2:1990
Current
The latest, up-to-date edition.
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for copper foil for use in the manufacture of copper-clad base materials
Hardcopy , PDF
English
28-02-1990
National foreword
Committees responsible
Specification
1. Scope
2. Designation
3. Mass per unit area, and thickness
4. Chemical analysis
5. Electrical properties
6. Tensile properties (requirements for either
lengthwise or crosswise direction)
7. Surface finish
8. Solderability
9. Surface treatment
10. Roll dimensions and tolerances
11. Packaging
Appendix
Sampling and methods of test
For use in the manufacture of copper clad laminated sheets and of copper clad flexible materials used for printed wiring.
Committee |
EPL/501
|
DevelopmentNote |
Also numbered as IEC 249-3A Supersedes 89/23232 DC (08/2005)
|
DocumentType |
Standard
|
Pages |
14
|
PublisherName |
British Standards Institution
|
Status |
Current
|
This specification gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used for printed wiring.
This specification applies to copper foil supplied in rolls, but by agreement between purchaser and vendor, may be applied to foil produced in sheets.
BS EN 60249-2-13:1994 | Base material for printed circuits. Specifications Flexible copper-clad polyimide film, general purpose grade |
BS EN 60249-2-1:1994 | Specifications Specification for phenolic cellulose paper copper-clad laminated sheet, high electrical quality |
BS EN 60249-2-19:1993 | Specifications Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards |
BS EN 60249-2-15:1994 | Specifications Flexible copper-clad polyimide film, of defined flammability |
BS EN 60249-2-8:1995 | Specifications Specification for flexible copper-clad polyester (PETP) film |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
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