BS 6221-25:2000
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies
Hardcopy , PDF
12-03-2014
English
15-11-2000
Committees responsible
Foreword
1 Scope
2 Normative references
3 Terminology
4 Classification of rework activities
5 Pre-soldering rework
6 Factors affecting post-soldering rework
7 Preparation for post-soldering rework and repair
8 Post-soldering rework
9 Selection of rework equipment, tools and methods
10 Manual rework tools and methods
11 Mechanized and programmable rework machines
12 Ancillary tools and equipment
13 Rework recording procedures
14 Training of operators and inspectors
15 Field repair
Bibliography
Figure 1 - Typical in-process surface mount rework activities
Table 1 - Recommended tools for different component types
This part of BS 6221 gives guidance on the procedures to be adopted in the rework of soldered surface mounted printed board assemblies. It is applicable to activities specific to the processes used to manufacture soldered surface mounted assemblies on printed boards and to the relevant parts of resulting products. The standard is also applicable to activities that can form part of the work in assembling mixed technology products.
Committee |
EPL/501
|
DevelopmentNote |
Supersedes 99/203718 DC (09/2005) Reviewed and confirmed by BSI, July 2007. (06/2007)
|
DocumentType |
Standard
|
Pages |
28
|
PublisherName |
British Standards Institution
|
Status |
Withdrawn
|
Supersedes |
DEFSTAN 00-970(PT0)/9(2012) : 2012 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT0)/17(2016) : 2016 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT9)/5(2009) : 2009 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 9: UAV SYSTEMS |
DEFSTAN 00-970(PT0)/7(2011) : 2011 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT0)/14(2014) : 2014 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT0)/12(2014) : 2014 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT0)/11(2013) : 2013 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT0)/13(2014) : 2014 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT0)/15(2015) : 2015 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT0)/8(2011) : 2011 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT0)/16(2015) : 2015 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
DEFSTAN 00-970(PT0)/10(2013) : 2013 | DESIGN AND AIRWORTHINESS REQUIREMENTS FOR SERVICE AIRCRAFT - PART 0: PROCEDURES FOR USE, CONTENT AND DEFINITIONS |
BS EN 100015-1:1992 | Basic specification. Protection of electrostatic sensitive devices Harmonized system of quality assessment for electronic components. Basic specification: protection of electrostatic sensitive devices. General requirements |
BS EN 61760-1:2006 | Surface mounting technology Standard method for the specification of surface mounting components (SMDs) |
BS EN 61191-1:2013 | Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
97/206324 DC : DRAFT MAY 1997 | |
BS QC 200012:1996 | Process assessment schedule for printed board design facilities |
IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
CECC 210 003 : 1996 | TECHNOLOGY APPROVAL SCHEDULE: RIGID PRINTED BOARDS |
IEC 61192-1:2003 | Workmanship requirements for soldered electronic assemblies - Part 1: General |
BS CECC 200025:1998 | Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities |
BS EN 100015-3:1994 | Basic specification. Protection of electrostatic sensitive devices Requirements for clean room areas |
BS EN 100015-4:1994 | Basic specification. Protection of electrostatic sensitive devices Requirements for high voltage environments |
BS EN 100015-2:1994 | Basic specification. Protection of electrostatic sensitive devices Requirements for low humidity conditions |
IEC 61192-2:2003 | Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies |
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