• IEC 61192-3:2002

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  31-12-2021

    Language(s):  English - French

    Published date:  17-12-2002

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Classification
       4.2 Conflict
       4.3 Inspection techniques
       4.4 Interpretation of requirements
    5 Component preparation processes
       5.1 Lead forming
       5.2 Lead protrusion and clinching
       5.3 Lead cutting/cropping
       5.4 Pre-tinning
    6 Masking attributes
       6.1 Misalignment
       6.2 Improper adhesion
       6.3 Thermal capability
    7 Insertion of through-hole components
       7.1 General requirements
       7.2 Orientation and mounting criteria
       7.3 Missing component
       7.4 Wrong component
       7.5 Damaged component
    8 Soldering process attributes
       8.1 General requirements
       8.2 Misalignment
       8.3 Damaged components
       8.4 Solder joint characteristics
    9 Cleaning attributes
       9.1 Flux residues
       9.2 Other residues
    10 Rework/replacement attributes
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note To be used in conjunction with IEC 61192-1, IEC 61192-2 and IEC 61192-4. (12/2002) Stability Date: 2017. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    IEC 60294:2012 Measurement of the dimensions of a cylindrical component with axial terminations
    BS EN 60115-2:2015 Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors
    EN 60115-2 : 2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS (IEC 60115-2:2014, MODIFIED)
    BS EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    IEC 60115-2:2014 Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
    BS EN 60717:2012 METHOD FOR THE DETERMINATION OF THE SPACE REQUIRED BY CAPACITORS AND RESISTORS WITH UNIDIRECTIONAL TERMINATIONS
    BS EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    BS EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    BS EN 61192-2:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
    BS EN 60068-2-82:2007 ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST TX: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
    BS EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    BS EN 60294:2012 MEASUREMENT OF THE DIMENSIONS OF A CYLINDRICAL COMPONENT WITH AXIAL TERMINATIONS
    BS 6221-25:2000 PRINTED WIRING BOARDS - GUIDE TO THE REWORK AND REPAIR OF SOLDERED SURFACE MOUNTED PRINTED BOARD ASSEMBLIES
    97/206324 DC : DRAFT MAY 1997
    97/230541 DC : DRAFT AUG 1997
    NF EN 60068-2-82 : 2013 ENVIRONMENTAL TESTING - PART 2-82 : TESTS - TEST XW1 : WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS
    EN 61193-1 : 2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
    EN 61192-2 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
    IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
    EN 60717 : 2012 METHOD FOR THE DETERMINATION OF THE SPACE REQUIRED BY CAPACITORS AND RESISTORS WITH UNIDIRECTIONAL TERMINATIONS (IEC 60717:2012)
    EN 61192-1 : 2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
    IEC 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
    IEC 60717:2012 Method for the determination of the space required by capacitors and resistors with unidirectional terminations
    EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    EN 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
    EN 60294 : 2012 MEASUREMENT OF THE DIMENSIONS OF A CYLINDRICAL COMPONENT WITH AXIAL TERMINATIONS (IEC 60294:2012)
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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