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  • IEC 61192-1:2003

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Workmanship requirements for soldered electronic assemblies - Part 1: General

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  31-12-2021

    Language(s):  English - French

    Published date:  20-02-2003

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Order of precedence
       4.2 Process control
       4.3 Facilities
       4.4 Process identification
    5 Pre-process activities
       5.1 Design checks
       5.2 Specification and procurement of components
       5.3 Specification and procurement of printed boards
       5.4 Specification and procurement of process materials
       5.5 Inspection plan, inspection facilities and handling
       5.6 Storage and kitting of components, boards and materials
       5.7 Handling during assembly, packaging and shipping
       5.8 Electrical testing
    6 Component preparation
       6.1 Lead and termination solderability
       6.2 Lead forming
       6.3 Lead flattening
       6.4 Lead cropping
       6.5 Lead coplanarity
       6.6 Thermal shock during re-tinning
       6.7 Moisture and gas traps
    7 Mounting structure and printed board preparation
       7.1 Surface preparation
       7.2 Temporary masking requirements
       7.3 Gold on printed board surface-mount lands
       7.4 Printed board condition
    8 Surface-mount solder paste deposition
       8.1 Description of process
       8.2 Storage and handling of solder paste
       8.3 Screen (off-contact) printing
       8.4 Stencil (in-contact) printing
       8.5 Syringe dispensing
       8.6 Transfer deposition of solder preforms
    9 Non-conductive adhesive deposition and curing
       9.1 Stencil printing
       9.2 Syringe dispensing
       9.3 Pin transfer printing
       9.4 Adhesive curing
    10 Surface-mounted component placement
       10.1 Leadless discrete components with metallized terminations
       10.2 Leadless circular cylinder components, for example, metal
             electrode leadless faces (MELFs)
       10.3 Leaded discrete small component packages
       10.4 Leaded integrated circuit packages
       10.5 Leaded 'fine-pitch' integrated circuit packages
       10.6 Modified leaded through-hole packages
       10.7 Leadless chip carrier packages
       10.8 Placement equipment
    11 Through-hole component insertion
       11.1 General
       11.2 Axial lead components (two leads)
       11.3 Radial lead components (two leads)
       11.4 Radial lead components (three or more leads)
       11.5 Multilead integrated circuit packages
       11.6 Pin grid array (PGA) components
       11.7 Surface-mount packages modified for insertion
       11.8 Large components
       11.9 Insertion methods and equipment
       11.10 Cutting and clinching leads
    12 Placement of terminals and press-fit pins
       12.1 Attachment of terminals to printed boards
       12.2 Soldering wires and component leads to terminals
    13 Reflow soldering
       13.1 Infrared reflow soldering in pass-through equipment
       13.2 Convection reflow soldering in pass-through equipment
       13.3 Mixed infrared and convection reflow soldering in
             pass-through equipment
       13.4 Vapour phase reflow soldering
       13.5 Laser scan reflow soldering
       13.6 Thermode (hot bar) reflow soldering
       13.7 Hot gas multijet reflow soldering
       13.8 Focused infrared multi-point reflow soldering
    14 Immersion soldering
       14.1 General requirements
       14.2 Wave soldering
       14.3 Drag soldering
       14.4 Hot dip soldering
    15 Individual point soldering
       15.1 Manual soldering with an iron
       15.2 Hot gas pencil reflow soldering
    16 Cleanliness/cleaning
       16.1 Use of 'no clean' fluxes
       16.2 Cleaning materials
       16.3 Cleaning processes
       16.4 Cleanliness assessment
    17 Electrical test
       17.1 In-circuit test
       17.2 Functional test
       17.3 Test probes and probe lands
    18 Rework and repair
       18.1 General
       18.2 Unmarked components
       18.3 Pre-heating printed boards and sensitive components
       18.4 Re-use of removed components
       18.5 Selection of rework tools and equipment
       18.6 Surface-mounted component realignment
       18.7 Adding solder to existing joints
       18.8 Removing excess solder
       18.9 Component removal
       18.10 Component replacement
       18.11 Repair of assemblies returned from the field
    19 Conformal coatings, including solder resist
       19.1 General
       19.2 Conformal protective coating
       19.3 Solder mask coating
    20 Packaging and shipping
       20.1 Materials
       20.2 Mechanical protection
       20.3 Marking/labelling
       20.4 Handling
    21 Training
       21.1 Training of designers, engineers and senior line management
       21.2 Training production line personnel
    Figures
    Tables

    Abstract - (Show below) - (Hide below)

    Specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. Defines requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies. Enables achievement of high yields and high product quality through process control in production.

    General Product Information - (Show below) - (Hide below)

    Development Note To be used in conjunction with IEC 61192-2, IEC 61192-3 and IEC 61192-4. (02/2003) Stability Date: 2017. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61188-5-1:2002 PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
    I.S. EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    I.S. EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
    EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
    EN 62137-1-3:2009 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    12/30254697 DC : 0 BS ISO 16525-9 - ADHESIVES - TEST METHODS FOR ISOTROPICALLY ELECTRICALLY CONDUCTING ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS
    BS ISO 16525-9:2014 ADHESIVES - TEST METHODS FOR ISOTROPIC ELECTRICALLY CONDUCTIVE ADHESIVES - PART 9: DETERMINATION OF HIGH-SPEED SIGNAL-TRANSMISSION CHARACTERISTICS
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 62137-1-3:2008 Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
    KTA 3505 : 2015(R2017) TYPE TESTING OF MEASURING SENSORS AND TRANSDUCERS OF THE INSTRUMENTATION AND CONTROL SYSTEM IMPORTANT TO SAFETY
    BS EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
    97/206324 DC : DRAFT MAY 1997
    CEI EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    UTEC 90 720-1 : 2000 ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES
    BS EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    BS 6221-25:2000 PRINTED WIRING BOARDS - GUIDE TO THE REWORK AND REPAIR OF SOLDERED SURFACE MOUNTED PRINTED BOARD ASSEMBLIES
    NF EN 62137-1-3 : 2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    I.S. EN 61192-2:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
    I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
    I.S. EN 62137-1-3:2009 SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST
    I.S. EN 61188-5-1:2002 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
    ISO 16525-9:2014 Adhesives Test methods for isotropic electrically conductive adhesives Part 9: Determination of high-speed signal-transmission characteristics
    IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    BS EN 62137-1-3:2009 Surface mounting technology. Environmental and endurance test methods for surface mount solder joint Cyclic drop test
    97/230541 DC : DRAFT AUG 1997
    IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
    BS EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    BS EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    BS EN 61192-2:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
    I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    EN 61193-1:2002 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
    EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    EN 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    NF EN 61188-5-1 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 61190-1-2:2014 Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
    IEC TS 61340-5-2:1999 Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide
    IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
    IEC 61188-1-1:1997 Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    IEC 60326-9:1991 Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections
    ISO 9002:1994 Quality systems — Model for quality assurance in production, installation and servicing
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 60326-11:1991 Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections
    ISO 9001:2015 Quality management systems - Requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    IEC 61192-2:2003 Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    IEC 60326-10:1991 Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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