BS 6221-6:1982
Current
The latest, up-to-date edition.
Printed wiring boards Specification for multilayer printed wiring boards
Hardcopy , PDF
English
29-01-1982
National foreword
Cooperating organizations
Specification
1. Introduction
2. Scope
3. Object
4. General
5. Test specimens
6. Relevant specification
7. Characteristics of printed boards
8. Composite test pattern
Tables
I. Basic characteristics
II. Additional characteristics
Figures
1. Composite test pattern
2. Length of defect
3. Examples of soldered holes
Fundamental information on characteristics to be assessed and requirements for the boards irrespective of their method of manufacture and includes a composite test pattern.
Committee |
EPL/501
|
DevelopmentNote |
Supersedes BS 4025(1966) and BS 6221(1982) (07/2004) Also numbered as IEC 60326-6 Supersedes 81/27114 DC and 84/28917 DC (09/2005)
|
DocumentType |
Standard
|
Pages |
30
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
This standard is applicable to multilayer printed boards irrespective of their method of manufacture. It is intended as a basis on which agreements between purchaser and vendor can be made. The term “relevant specification?? used herein refers then to such agreements.
BS 6221-21:1984 | Printed wiring boards Guide for the repair of printed wiring boards |
BS 6221-5:1982 | Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes |
BS 6221-7:1982 | Printed wiring boards Method for specifying single and double sided flexible printed wiring boards without through connections |
BS 6221-4:1982 | Printed wiring boards Method for specifying single and double sided printed wiring boards with plain holes |
BS 6221-2:1991 | Printed wiring boards Methods of test |
BS 4584-103.3:1992 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
BS 6221-2:1982 | Printed wiring boards Methods of test |
BS 6221-12:1992 | Printed wiring boards Specification for mass lamination panels (semi-manufactured multilayer printed boards) |
BS 6221-8:1982 | Printed wiring boards Method for specifying single and double sided flexible printed wiring boards with through connections |
BS 6221-22:1990 | Printed wiring boards Guide to the use of printed wiring board substrate materials: surface mount technology |
BS 5830:1979 | Specification for grid system for printed circuits |
BS 6221-2:1991 | Printed wiring boards Methods of test |
IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
BS 6221-5:1982 | Printed wiring boards Specification for single and double sided rigid printed boards with plated-through holes |
IEC 60052:2002 | Voltage measurement by means of standard air gaps |
IEC 60326-1:1984 | Printed boards - Part 1: General information for the specification writer |
BS 4584:1970 | Specification for metal clad base materials for printed circuits. Methods of test |
BS 2011(1967) : LATEST | |
BS 6221-3:1982 | Printed wiring boards. Guide for the design and use of printed wiring boards |
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