BS CECC 00802:1994
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Harmonized system of quality assessment for electronic components. Guidance document: CECC Standard method for the specification of surface mounting components (SMDs) of assessed quality
Hardcopy , PDF
04-11-2009
English
15-11-1994
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
Preface
1. Introduction
2. Scope
3. Terminology
4. General requirements
4.1 Content of Specification
4.2 Declaration of process suitability
4.3 Packaging and packaging marking
4.4 Component marking
4.5 Storage
4.6 Component outline
4.7 Mechanical stress
4.8 Ordering information
5. Identification of assembly process conditions
5.1 General
5.2 Placement
5.3 Securing the component on substrate prior to
soldering
5.4 Soldering methods
5.5 Cleaning
5.6 Removal and/or replacement of SMDs
5.7 Special handling conditions
6. Reference conditions
6.1 Process Limits
6.2 Classification
6.3 Reference set of assembly cleaning conditions
7. Tests
7.1 General
7.2 Soldering
7.3 Resistance to mechanical forces
7.4 Resistance to cleaning solvent
Annex A: Test methods for soldering
Annex B: Shear test and substrate bending test
Applies to all electronic components covered by the CECC System where these components are required to be assessed with respect to their application to surface mounting.
| Committee |
W/-
|
| DevelopmentNote |
Supersedes BS CECC 00802(1991) and 92/31292 DC. (01/2006)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| Standards | Relationship |
| CECC 00802 : 1994 | Identical |
| BS EN 100015-1:1992 | Basic specification. Protection of electrostatic sensitive devices Harmonized system of quality assessment for electronic components. Basic specification: protection of electrostatic sensitive devices. General requirements |
| BS 2011-2.1Td:1990 | Environmental testing. Tests Test Td. Solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| BS 9000-2(1996) : 1996 | GENERAL REQUIREMENTS FOR A SYSTEM FOR ELECTRONIC COMPONENTS OF ASSESSED QUALITY - SPECIFICATION FOR THE NATIONAL IMPLEMENTATION OF THE CECC SYSTEM |
| BS 2011-2.1XA(1981) : 1981 AMD 7553 | ENVIRONMENTAL TESTING - TESTS - TEST XA AND GUIDANCE - IMMERSION IN CLEANING SOLVENTS |
| BS CECC 00111-0:1994 | Rule of Procedure 11. Specifications An introduction to the types of specifications applicable within the CECC system |
| BS 4584-102.5(1990) : 1990 | METAL CLAD BASE MATERIALS FOR PRINTED WIRING BOARDS - COPPER CLAD BASE MATERIALS - SPECIFICATION FOR EPOXIDE WOVEN GLASS FABRIC COPPER CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) |
| BS 3934-6:1992 | Mechanical standardization of semiconductor devices Specification for the preparation of outline drawings of surface mounted semiconductor device packages |
| BS 2011-2.1T:1981 | Environmental testing. Tests Test T. Soldering |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.