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  • CECC 00802 : 1994

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    GUIDANCE DOCUMENT: CECC STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING (SMDs) OF ASSESSED QUALITY

    Available format(s): 

    Withdrawn date:  02-06-2016

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Cenelec Electronic Components Committee

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Preface
    1 Introduction
    2 Scope
    3 Terminology
    4 General requirements
    4.1 Content of Specification
    4.2 Declaration of process suitability
    4.3 Packaging and packaging marking
    4.4 Component marking
    4.5 Storage
    4.6 Component outline
    4.7 Mechanical stress
    4.8 Ordering information
    5 Identification of assembly process conditions
    5.1 General
    5.2 Placement
    5.3 Securing the component on substrate prior to
         soldering
    5.4 Soldering methods
    5.5 Cleaning
    5.6 Removal and/or replacement of SMDs
    5.7 Special handling conditions
    6 Reference conditions
    6.1 Process Limits
    6.2 Classification
    6.3 Reference set of assembly cleaning conditions
    7 Tests
    7.1 General
    7.2 Soldering
    7.3 Resistance to mechanical forces
    7.4 Resistance to cleaning solvent
    Annexes
    A Test methods for soldering
    B Shear test and substrate bending test

    Abstract - (Show below) - (Hide below)

    Gives a reference set of process conditions and related test conditions that shall be used when compiling component specifications. Coverage includes component marking, storage, component outline, mechanical stress, ordering information, placement, soldering methods, process limits, and reference set of assembly cleaning conditions.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Cenelec Electronic Components Committee
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 160100 : 1997 CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION)
    EN 61811-54:2002 Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base
    BS EN 160100:1998 Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality
    BS EN 61811-53:2002 Electromechanical all-or-nothing relays Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 14 mm x 9 mm base
    BS EN 61811-55:2002 Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 11 mm x 7,5 mm (max.) base
    BS EN 168000:1996 Harmonized system of quality assessment for electronic components. Generic specification: quartz crystal units
    BS EN 61811-54:2002 Electromechanical non-specified time all-or-nothing relays of assessed quality Blank detail specification. Electromechanical all-or-nothing telecom relays of assessed quality. Two change-over contacts, 15 mm x 7,5 mm base
    BS EN 167000:1993 Harmonized system of quality assessment for electronic components. Generic specification: piezoelectric filters
    BS EN 130000:1994 Harmonized system of quality assessment for electronic components. Generic specification: fixed capacitors
    IEC 61811-53:2002 Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base
    IEC 61811-55:2002 Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base
    IEC 61811-54:2002 Electromechanical all-or-nothing relays - Part 54: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 15 mm x 7,5 mm base
    I.S. EN 160100:1998 CAPABILITY APPROVAL OF MANUFACTURERS OF PRINTED BOARD ASSEMBLIES OFASSESSED QUALITY (SECTIONAL SPECIFICATION)
    I.S. EN 61811-54:2002 ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 54: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 15 MM X 7,5 MM BASE
    I.S. EN 61811-53:2002 ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 53: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 14 MM X 9 MM BASE
    I.S. EN 61811-55:2002 ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 55: BLANK DETAIL SPECIFICATION - ELECTROMECHANICAL ALL-OR-NOTHING TELECOM RELAYS OF ASSESSED QUALITY - TWO CHANGE-OVER CONTACTS, 11 MM X 7,5 MM (MAX.) BASE
    I.S. EN 116000-3:1998 GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES
    EN 61811-55:2002 Electromechanical all-or-nothing relays - Part 55: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 11 mm x 7,5 mm (max.) base
    EN 61811-53:2002 Electromechanical all-or-nothing relays - Part 53: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Two change-over contacts, 14 mm x 9 mm base
    EN 116000-3 : 1996 GENERIC SPECIFICATION: ELECTROMECHANICAL ALL-OR-NOTHING RELAYS - PART 3: TEST AND MEASUREMENT PROCEDURES
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