Foreword
Preface
1. Introduction
2. Scope
3. Terminology
4. General requirements
4.1 Content of Specification
4.2 Declaration of process suitability
4.3 Packaging and packaging marking
4.4 Component marking
4.5 Storage
4.6 Component outline
4.7 Mechanical stress
4.8 Ordering information
5. Identification of assembly process conditions
5.1 General
5.2 Placement
5.3 Securing the component on substrate prior to
soldering
5.4 Soldering methods
5.5 Cleaning
5.6 Removal and/or replacement of SMDs
5.7 Special handling conditions
6. Reference conditions
6.1 Process Limits
6.2 Classification
6.3 Reference set of assembly cleaning conditions
7. Tests
7.1 General
7.2 Soldering
7.3 Resistance to mechanical forces
7.4 Resistance to cleaning solvent
Annex A: Test methods for soldering
Annex B: Shear test and substrate bending test