BS CECC 64000:1990
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Harmonized system of quality assessment for electronic components: generic specification: film resistor networks
Hardcopy , PDF
15-11-1997
English
30-04-1990
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
Preface
Section 1
1.1 Scope
1.2 Technological classification of Film Resistor
Networks
Section 2 - General
2.1 Order of precedence
2.2 Related documents
2.3 Units, symbols and terminology
2.4 Preferred values
2.5 Marking
2.6 Coding
Section 3 - Quality assessment procedures
3.1 Primary stage of manufacture
3.2 Manufacturing stages and sub-contracting
3.3 Manufacturer approval
3.4 Approval of fixed resistor networks
3.5 Qualification approval
3.6 Capability approval
3.7 Certified test records
3.8 Delayed deliveries
3.9 Delivery of networks subjected to destructive
or non destructive tests
3.10 Supplementary procedure for delivery
3.11 Supplementary information
Section 4 - Test and measurements procedures
4.1 General
4.2 Standard conditions for testing
4.3 Visual examination and check of dimensions
4.4 Electrical measurement procedures
4.5 Environmental testing procedure
Defines the terms, inspection procedures and methods of test for use in sectional and detailed specifications for qualification and capability approval of fixed resistors.
| Committee |
W/-
|
| DevelopmentNote |
Being replaced by the BS EN 165000 series.
|
| DocumentType |
Standard
|
| Pages |
48
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Standards | Relationship |
| CECC 64000 : 1988 | Identical |
| CECC 00107(PT3) : 80 AMD 1 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-27:2008 | Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60068-2-13:1983 | Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
| CECC 00100 : 1988 | BASIC RULES - TO BE USED IN CONNECTION WITH THE INTERNAL REGULATIONS OF THE FEN e.V |
| IEC 60027-1:1992 | Letters symbols to be used in electrical technology - Part 1: General |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| IEC 60068-2-3:1969 | Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
| CECC 00107(PT1) : 1982 | CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - QUALITY ASSESSMENT PROCEDURE FOR GENERAL USAGE |
| IEC 60068-2-2:2007 | Environmental testing - Part 2-2: Tests - Test B: Dry heat |
| IEC TR 60440:1973 | Method of measurement of non-linearity in resistors |
| IEC 60062:2016 | Marking codes for resistors and capacitors |
| IEC 60063:2015 | Preferred number series for resistors and capacitors |
| IEC 60068-2-29:1987 | Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
| IEC 60068-2-1:2007 | Environmental testing - Part 2-1: Tests - Test A: Cold |
| IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
| CECC 00007 : 1978 | BASIC SPECIFICATION: SAMPLING PLANS AND PROCEDURES FOR INSPECTION BY ATTRIBUTES |
| IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
| IEC 60068-2-30:2005 | Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |
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