BS CECC23400(1990) : 1990 AMD 7367
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITHOUT THROUGH CONNECTIONS
15-11-1992
06-12-2012
Applies to flexible printed boards without through connections regardless of their method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). BS AMD 7367 RENUMBERS THIS STANDARD TO BS EN 123400
| Committee |
ECL/19
|
| DevelopmentNote |
Renumbered and superseded by BS EN 123400. Supersedes 89/23561 DC. (08/2005)
|
| DocumentType |
Standard
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| CECC 23400 : 1985 | Identical |
| BS EN 123400-800:1992 | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
| CECC 23000 : 1985 | GENERIC SPECIFICATION: PRINTED BOARDS |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| CECC 00010 : 1980 AMD 1 | BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| CECC 00111 : 80 AMD 3 | CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
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