BS CECC23500(1990) : 1990 AMD 7369
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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SPECIFICATION FOR HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: SECTIONAL SPECIFICATION: FLEXIBLE PRINTED BOARDS WITH THROUGH CONNECTIONS
15-11-1992
06-12-2012
Applies to flexible printed boards with through connections regardless of their method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection). BS AMD 7369 RENUMBERS THIS STANDARD TO BS EN 123500
| Committee |
ECL/19
|
| DevelopmentNote |
Renumbered and superseded by BS EN 123500. Supersedes 89/23560 DC. (08/2005)
|
| DocumentType |
Standard
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| CECC 23500 : 1985 | Identical |
| BS EN 123500-800:1992 | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
| CECC 23000 : 1985 | GENERIC SPECIFICATION: PRINTED BOARDS |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| CECC 00100 : 1988 | BASIC RULES - TO BE USED IN CONNECTION WITH THE INTERNAL REGULATIONS OF THE FEN e.V |
| CECC 00010 : 1980 AMD 1 | BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
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