BS EN 165000-3:1996
Current
The latest, up-to-date edition.
Film and hybrid integrated circuits Self-audit checklist and report for film and hybrid integrated circuit manufacturers
Hardcopy , PDF
English
15-10-1996
1 Scope
2 Document information
2.1 Introduction
2.2 Related documents
3 General requirements
3.1 Self-audit checklist and report
3.2 Description of report/company structure
3.3 Approval information
3.4 Summary of testing
3.5 Analytical methods
3.6 Control of procurement sources and incoming
material
3.7 Environmental control and static handling
3.8 Change notification requirements
3.9 Hybrid design
4 Thick film processing
4.1 Artwork and screen fabrication
4.2 Substrates
4.3 Substrate saw or scribe and break and substrate
hold drilling
4.4 Thick film pastes and printing
4.5 Drying and firing
4.6 Resistor trimming
4.7 Inspection and test of processing
4.8 Rework
5 Thin film processing
5.1 Artwork and mask fabrication
5.2 Substrates
5.3 Substrate saw or scribe and break and substrate
hole drilling
5.4 Thin film processing materials and pattern forming
5.5 Drying and stabilization
5.6 Resistor trimming
5.7 Rework
6 Hybrid assembly
6.1 Solder assembly
6.1.1 Kitting
6.1.2 Cleaning
6.1.3 Component placement
6.1.4 Substrate attach
6.1.5 Soldering
6.1.6 Encapsulation
6.1.7 Rework
6.1.8 Marking
6.2 Chip and assembly
6.2.1 Kitting
6.2.2 Cleaning
6.2.3 Component placement
6.2.4 Substrate attach
6.2.5 Wire-bonding
6.2.6 Package seal
6.2.7 Rework
6.2.8 Marking
7 Test and dispatch
7.1 Electrical tests
7.2 Burn-in
7.3 Endurance
7.4 Dry heat (stabilization bake)
7.5 Change of temperature
7.6 Damp heat testing
7.7 Particle impact noise detection
7.8 Fine leak test
7.9 Gross leak test
7.10 Resistance to soldering heat
7.11 Termination robustness
7.12 Acceleration
7.13 Vibration
7.14 Shock
7.15 Dimensions
7.16 Bond-pull testing
7.17 Salt mist
7.18 Flammability
7.19 Solderability
7.20 Resistance to solvents
7.21 Internal visual inspection
7.22 External visual inspection
7.23 Radiographic inspection
7.24 Acceptance to dispatch
To be used by a hybrid microcircuit manufacturer's internal assessment team to provide manager and ONS with data on process control demonstrating compliance with EM 165000-1. Not intended to include Quality System requirements.
Committee |
EPL/47
|
DevelopmentNote |
Reviewed and confirmed by BSI, Feb 2005. (02/2005) Supersedes 94/216400 DC. (09/2005)
|
DocumentType |
Standard
|
Pages |
104
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
Standards | Relationship |
I.S. EN 165000-3:1998 | Identical |
DIN EN 165000-3:1996-11 | Identical |
NEN EN 165000-3 : 1996 | Identical |
EN 165000-3:1996 | Identical |
SN EN 165000-3 : 1996 | Identical |
BS EN 165000-4:1996 | Film and hybrid integrated circuits Customer information, product assessment level schedules and blank detail specification |
BS EN 165000-2:1996 | Film and hybrid integrated circuits Internal visual inspection and special tests |
BS EN 165000-2:1996 | Film and hybrid integrated circuits Internal visual inspection and special tests |
EN 100012 : 1995 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: X-RAY INSPECTION OF ELECTRONIC COMPONENTS |
EN 100114-1 : 1996 | RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION |
CECC 00016 : 1990 | BASIC SPECIFICATION - BASIC REQUIREMENTS FOR THE USE OF STATISTICAL PROCESS CONTROL (SPC) IN THE CECC SYSTEM |
BS EN 165000-1:1996 | Film and hybrid integrated circuits Generic specification. Capability approval procedure |
BS EN 165000-4:1996 | Film and hybrid integrated circuits Customer information, product assessment level schedules and blank detail specification |
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