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BS EN 165000-3:1996

Current

Current

The latest, up-to-date edition.

Film and hybrid integrated circuits Self-audit checklist and report for film and hybrid integrated circuit manufacturers

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-10-1996

€371.62
Excluding VAT

1 Scope
2 Document information
2.1 Introduction
2.2 Related documents
3 General requirements
3.1 Self-audit checklist and report
3.2 Description of report/company structure
3.3 Approval information
3.4 Summary of testing
3.5 Analytical methods
3.6 Control of procurement sources and incoming
       material
3.7 Environmental control and static handling
3.8 Change notification requirements
3.9 Hybrid design
4 Thick film processing
4.1 Artwork and screen fabrication
4.2 Substrates
4.3 Substrate saw or scribe and break and substrate
       hold drilling
4.4 Thick film pastes and printing
4.5 Drying and firing
4.6 Resistor trimming
4.7 Inspection and test of processing
4.8 Rework
5 Thin film processing
5.1 Artwork and mask fabrication
5.2 Substrates
5.3 Substrate saw or scribe and break and substrate
       hole drilling
5.4 Thin film processing materials and pattern forming
5.5 Drying and stabilization
5.6 Resistor trimming
5.7 Rework
6 Hybrid assembly
6.1 Solder assembly
6.1.1 Kitting
6.1.2 Cleaning
6.1.3 Component placement
6.1.4 Substrate attach
6.1.5 Soldering
6.1.6 Encapsulation
6.1.7 Rework
6.1.8 Marking
6.2 Chip and assembly
6.2.1 Kitting
6.2.2 Cleaning
6.2.3 Component placement
6.2.4 Substrate attach
6.2.5 Wire-bonding
6.2.6 Package seal
6.2.7 Rework
6.2.8 Marking
7 Test and dispatch
7.1 Electrical tests
7.2 Burn-in
7.3 Endurance
7.4 Dry heat (stabilization bake)
7.5 Change of temperature
7.6 Damp heat testing
7.7 Particle impact noise detection
7.8 Fine leak test
7.9 Gross leak test
7.10 Resistance to soldering heat
7.11 Termination robustness
7.12 Acceleration
7.13 Vibration
7.14 Shock
7.15 Dimensions
7.16 Bond-pull testing
7.17 Salt mist
7.18 Flammability
7.19 Solderability
7.20 Resistance to solvents
7.21 Internal visual inspection
7.22 External visual inspection
7.23 Radiographic inspection
7.24 Acceptance to dispatch

To be used by a hybrid microcircuit manufacturer's internal assessment team to provide manager and ONS with data on process control demonstrating compliance with EM 165000-1. Not intended to include Quality System requirements.

Committee
EPL/47
DevelopmentNote
Reviewed and confirmed by BSI, Feb 2005. (02/2005) Supersedes 94/216400 DC. (09/2005)
DocumentType
Standard
Pages
104
PublisherName
British Standards Institution
Status
Current
Supersedes

Standards Relationship
I.S. EN 165000-3:1998 Identical
DIN EN 165000-3:1996-11 Identical
NEN EN 165000-3 : 1996 Identical
EN 165000-3:1996 Identical
SN EN 165000-3 : 1996 Identical

BS EN 165000-4:1996 Film and hybrid integrated circuits Customer information, product assessment level schedules and blank detail specification
BS EN 165000-2:1996 Film and hybrid integrated circuits Internal visual inspection and special tests

BS EN 165000-2:1996 Film and hybrid integrated circuits Internal visual inspection and special tests
EN 100012 : 1995 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: X-RAY INSPECTION OF ELECTRONIC COMPONENTS
EN 100114-1 : 1996 RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION
CECC 00016 : 1990 BASIC SPECIFICATION - BASIC REQUIREMENTS FOR THE USE OF STATISTICAL PROCESS CONTROL (SPC) IN THE CECC SYSTEM
BS EN 165000-1:1996 Film and hybrid integrated circuits Generic specification. Capability approval procedure
BS EN 165000-4:1996 Film and hybrid integrated circuits Customer information, product assessment level schedules and blank detail specification

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