• BS EN 60068-2-20 : 2008

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS

    Available format(s):  Hardcopy, PDF

    Withdrawn date:  13-05-2021

    Language(s):  English

    Published date:  01-01-2008

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Test Ta: Solderability of wire and tag terminations
      4.1 Object and general description of the test
          4.1.1 Test methods
          4.1.2 Specimen preparation
          4.1.3 Initial measurements
          4.1.4 Accelerated ageing
      4.2 Method 1: Solder bath
          4.2.1 Description of the solder bath
          4.2.2 Flux
          4.2.3 Procedure
          4.2.4 Test conditions
          4.2.5 Final measurements and requirements
      4.3 Method 2: Soldering iron at 350 degrees C
          4.3.1 Description of soldering irons
          4.3.2 Solder and flux
          4.3.3 Procedure
          4.3.4 Final measurements and requirements
      4.4 Information to be given in the relevant specification
    5 Test Tb: Resistance to soldering heat
      5.1 Object and general description of the test
          5.1.1 Test methods
          5.1.2 Initial measurements
      5.2 Method 1: Solder bath
          5.2.1 Description of the solder bath
          5.2.2 Flux
          5.2.3 Procedure
          5.2.4 Test conditions
          5.2.5 De-wetting
      5.3 Method 2: Soldering iron
          5.3.1 Description of soldering iron
          5.3.2 Solder and flux
          5.3.3 Procedure
      5.4 Recovery
      5.5 Final measurements and requirements
      5.6 De-wetting (if applicable)
      5.7 Information to be given in the relevant specification
    Annex A (informative) - Example of apparatus for accelerated
            steam ageing process
    Annex B (normative) - Specification for flux constituents
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    Gives procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes BS 2011-2.1T(1981) & 05/30138801 DC. (01/2009)
    Document Type Standard
    Publisher British Standards Institution
    Status Withdrawn
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 60068-2-2:2007 ENVIRONMENTAL TESTING - PART 2-2: TESTS - TEST B: DRY HEAT
    EN 60068-1:2014 ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013)
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 60068-2-78:2013 ENVIRONMENTAL TESTING - PART 2-78: TESTS - TEST CAB: DAMP HEAT, STEADY STATE (IEC 60068-2-78:2012)
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 60068-2-66:1994 ENVIRONMENTAL TESTING - PART 2: TEST METHODS - TEST CX: DAMP HEAT, STEADY STATE (UNSATURATED PRESSURIZED VAPOUR)
    EN 60068-2-54 : 2006 ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    EN 60194:2006 PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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