Skip to content
Please enter a keyword to search

  • EN 60068-2-20:2008

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
    View superseded by

    Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

    Available format(s): 

    Superseded date:  13-05-2021

    Language(s): 

    Published date:  25-09-2008

    Publisher:  European Committee for Standards - Electrical

    Pure ENs are not available for sale, please purchase a suitable national adoption

    Sorry this product is not available in your region.

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Test Ta: Solderability of wire and tag terminations
      4.1 Object and general description of the test
          4.1.1 Test methods
          4.1.2 Specimen preparation
          4.1.3 Initial measurements
          4.1.4 Accelerated ageing
      4.2 Method 1: Solder bath
          4.2.1 Description of the solder bath
          4.2.2 Flux
          4.2.3 Procedure
          4.2.4 Test conditions
          4.2.5 Final measurements and requirements
      4.3 Method 2: Soldering iron at 350 degrees C
          4.3.1 Description of soldering irons
          4.3.2 Solder and flux
          4.3.3 Procedure
          4.3.4 Final measurements and requirements
      4.4 Information to be given in the relevant specification
    5 Test Tb: Resistance to soldering heat
      5.1 Object and general description of the test
          5.1.1 Test methods
          5.1.2 Initial measurements
      5.2 Method 1: Solder bath
          5.2.1 Description of the solder bath
          5.2.2 Flux
          5.2.3 Procedure
          5.2.4 Test conditions
          5.2.5 De-wetting
      5.3 Method 2: Soldering iron
          5.3.1 Description of soldering iron
          5.3.2 Solder and flux
          5.3.3 Procedure
      5.4 Recovery
      5.5 Final measurements and requirements
      5.6 De-wetting (if applicable)
      5.7 Information to be given in the relevant specification
    Annex A (informative) Example of apparatus for accelerated
            steam ageing process
    Annex B (normative) Specification for flux constituents
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 60068-2-20:2008(E) outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following: - the solder globule test is deleted; - test conditions and requirements for lead-free solders are added.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 91
    Development Note Supersedes HD 323.2.20. (10/2008) Supersedes UNE 20501-2-20. (01/2012)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 62149-9:2014 Fibre optic active components and devices. Performance standards Seeded reflective semiconductor optical amplifier transceivers
    BS EN 61643-312:2013 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES
    BS EN 62246-1:2015 Reed switches Generic specification
    I.S. EN 61810-1:2015 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS
    BS EN 60115-2:2015 Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors
    BS EN 60384-26-1:2010 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
    I.S. EN 60252-1:2011 AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010 (EQV))
    BS EN 60939-1:2010 Passive filter units for electromagnetic interference suppression Generic specification
    CEI EN 61881-1 : 2012 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS
    CEI EN 61747-10-1 : 2014 LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL
    BS EN 60127-2:2014 Miniature fuses Cartridge fuse-links
    BS EN 60539-1:2016 Directly heated negative temperature coefficient thermistors Generic specification
    BS EN 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators Basic methods for the measurement
    BS EN 60384-1:2016 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    UNE-EN 60252-1:2011 AC motor capacitors -- Part 1: General - Performance, testing and rating - Safety requirements - Guidance for installation and operation
    BS EN 61881-3 : 2012 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS
    I.S. EN 61643-311:2013 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 311: PERFORMANCE REQUIREMENTS AND TEST CIRCUITS FOR GAS DISCHARGE TUBES (GDT) (IEC 61643-311:2013 (EQV))
    I.S. EN 60939-3:2015 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE
    I.S. EN 61881-1:2011 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS
    I.S. EN 60068-2-69:2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    I.S. EN IEC 61643-331:2018 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTION - PART 331: PERFORMANCE REQUIREMENTS AND TEST METHODS FOR METAL OXIDE VARISTORS (MOV)
    I.S. EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    BS EN 60252-1 : 2011 AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION
    I.S. EN 62246-1-1:2013 REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT (IEC 62246-1-1:2013 (EQV))
    I.S. EN 60252-2:2011 AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010 (EQV))
    I.S. EN 60939-1:2010 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
    EN 61881-1:2011 Railway applications - Rolling stock equipment - Capacitors for power electronics - Part 1: Paper/plastic film capacitors
    EN 60384-26-1:2010 Fixed capacitors for use in electronic equipment - Part 26-1: Blank detail specification - Fixed aluminum electrolytic capacitors with conductive polymer solid electrolyte - Assessment level EZ
    EN 62246-1:2015 Reed switches - Part 1: Generic specification
    EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2
    EN 60939-1:2010 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
    EN 60127-4:2005/A2:2013 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
    EN 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    EN 60068-3-13:2016 Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering
    EN 60684-2:2011 Flexible insulating sleeving - Part 2: Methods of test
    EN 60252-1 : 2011 AMD 1 2013 AC MOTOR CAPACITORS - PART 1: GENERAL - PERFORMANCE, TESTING AND RATING - SAFETY REQUIREMENTS - GUIDANCE FOR INSTALLATION AND OPERATION (IEC 60252-1:2010/A1:2013)
    EN 60115-2:2015 Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
    EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
    EN 140401:2009 Blank Detail Specification: Fixed low power film surface mount (SMD) resistors
    EN 61881-2 : 2012 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012)
    EN 140402:2015/A1:2016 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    BS EN 60115-8:2012 Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors
    CEI EN 62149-4 : 2011 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION
    CEI EN 60384-26-1 : 2011 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
    BS EN 60068-2-83:2011 Environmental testing Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
    BS EN IEC 62246-1-1:2018 Reed switches Generic specification. Blank detail specification
    BS EN 60749-15:2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
    CEI EN 62739-1 : 2014 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING
    I.S. EN 60115-8-1:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    CEI EN 61810-1 : 2016 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS
    I.S. EN 140402:2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    CEI EN 60384-26 : 2011 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
    I.S. EN 140401-802:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    EN 62884-1:2017 Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 1: Basic methods for the measurement
    I.S. EN 60115-8:2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD))
    I.S. EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    BS EN 60127-4 : 2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
    I.S. EN 61747-10-1:2013 LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL (IEC 61747-10-1:2013 (EQV))
    CEI EN 60068-2-58 : 2016 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    I.S. EN 60068-2-83:2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011 (EQV))
    CEI EN 61881-2 : 2013 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE
    EN IEC 62246-1-1:2018 Reed switches - Part 1-1: Generic specification - Blank detail specification
    VDE 0468-2-69 : 2018 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    EN 62922:2017 Organic light emitting diode (OLED) panels for general lighting - Performance Requirements
    EN 61760-3:2010 Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
    CEI EN 60068-3-13 : 1ED 2017 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
    BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    I.S. EN 62739-1:2013 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013 (EQV))
    BS EN 61811-1:2015 Electromechanical telecom elementary relays of assessed quality Generic specification and blank detail specification
    BS EN 61643-311:2013 Components for low-voltage surge protective devices Performance requirements and test circuits for gas discharge tubes (GDT)
    CEI EN 60115-8-1 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    CEI EN 62739-3 : 1ED 2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
    BS EN 61747-10-1:2013 Liquid crystal display devices Environmental, endurance and mechanical test methods. Mechanical
    BS EN 140401-803 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    BS EN 61169-1:2013 Radio-frequency connectors Generic specification. General requirements and measuring methods
    BS EN 62739-1:2013 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials without surface processing
    BS EN 61881-2:2012 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE
    BS EN 61760-3:2010 (published 2010-06) Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
    I.S. EN 60115-2:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    BS EN 61881-1 : 2011 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 1: PAPER/PLASTIC FILM CAPACITORS
    06/30155922 DC : 0 BS EN 140100 - SECTIONAL SPECIFICATION - FIXED LOW POWER FILM RESISTORS
    BS EN 62246-1-1:2013 REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT
    BS EN 60684-2:2011 Flexible insulating sleeving Methods of test
    14/30317306 DC : 0 BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    CEI EN 62884-1 : 1ED 2018 MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
    BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 140402 : 2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 60947-7-4:2013 LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013 (EQV))
    I.S. EN 62246-1:2015 REED SWITCHES - PART 1: GENERIC SPECIFICATION
    BS EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    EN IEC 61643-331:2018 Components for low-voltage surge protective devices - Part 331: Performance requirements and test methods for metal oxide varistors (MOV)
    I.S. EN 62884-1:2017 MEASUREMENT TECHNIQUES OF PIEZOELECTRIC, DIELECTRIC AND ELECTROSTATIC OSCILLATORS - PART 1: BASIC METHODS FOR THE MEASUREMENT
    CEI EN 60068-2-83 : 2012 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE
    I.S. EN 62149-4:2010 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 4: 1300 NM FIBRE OPTIC TRANSCEIVERS FOR GIGABIT ETHERNET APPLICATION
    I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
    EN 60749-15:2010/AC:2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
    EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    BS EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
    BS EN 60384-26:2010 Fixed capacitors for use in electronic equipment Sectional specification. Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte
    BS EN 60689:2009 Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values
    BS EN 60939-3:2015 Passive filter units for electromagnetic interference suppression Passive filter units for which safety tests are appropriate
    I.S. EN 60684-2:2011 FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST (IEC 60684-2:2011)
    CEI EN 60947-7-4 : 2014 LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS
    08/30186808 DC : DRAFT JULY 2008 BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS
    BS EN 140401-802 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    14/30311384 DC : 0 BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    BS EN 60068-3-13:2016 Environmental testing Supporting documentation and guidance on Test T. Soldering
    UNE-EN 60947-7-4:2014 Low-voltage switchgear and controlgear - Part 7-4: Ancillary equipment - PCB terminal blocks for copper conductors
    BS EN 62922:2017 Organic light emitting diode (OLED) panels for general lighting. Performance requirements
    BS EN 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality Generic specification
    EN 60939-3:2015/AC:2016-04 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 3: PASSIVE FILTER UNITS FOR WHICH SAFETY TESTS ARE APPROPRIATE (IEC 60939-3:2015/COR1:2016)
    BS EN 62878-1-1:2015 DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS
    I.S. EN 62739-3:2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
    BS EN 60115-8-1:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    CEI EN 60749-20 : 2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    EN IEC 61076-3-119:2018 Connectors for electrical and electronic equipment - Product requirements - Part 3-119: Rectangular connectors - Detail specification for shielded and unshielded, free and fixed 10-way connectors with push-pull coupling for industrial environments for data transmission with frequencies up to 100 MHz
    BS EN 60252-2 : 2011 AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS
    BS EN 60749-20:2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    EN 60068-2-69:2017/AC:2018-03 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017/COR1:2018)
    BS EN 61810-1:2015 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS
    I.S. EN 60127-6:2014 MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS
    EN 61810-1:2015/AC:2018-04 ELECTROMECHANICAL ELEMENTARY RELAYS - PART 1: GENERAL AND SAFETY REQUIREMENTS (IEC 61810-1:2015/COR1:2018)
    I.S. EN IEC 62246-1-1:2018 REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - BLANK DETAIL SPECIFICATION
    I.S. EN 61760-3:2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    I.S. EN 60068-3-13:2016 ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING
    I.S. EN 61643-312:2013 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 (EQV) + CORRIGENDUM JUL. 2013 (EQV))
    I.S. EN 60539-1:2016 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    BS EN 60947-7-4:2013 (published 2013-10) Low-voltage switchgear and controlgear Ancillary equipment. PCB terminal blocks for copper conductors
    CEI EN 62246-1-1 : 2014 REED SWITCHES - PART 1-1: GENERIC SPECIFICATION - QUALITY ASSESSMENT
    EN 140401-802:2007/A3:2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    DIN EN 60068-2-69 : 2007 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    EN 60384-1:2016 Fixed capacitors for use in electronic equipment - Part 1: Generic specification
    I.S. EN 60127-2:2014 MINIATURE FUSES - PART 2: CARTRIDGE FUSE-LINKS
    I.S. EN 61020-1:2009 ELECTROMECHANICAL SWITCHES FOR USE IN ELECTRICAL AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    I.S. EN 140401-803:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    I.S. EN 61169-1:2013 RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS
    I.S. EN 62391-1:2016 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    EN 61169-1:2013/AC:2016-02 RADIO-FREQUENCY CONNECTORS - PART 1: GENERIC SPECIFICATION - GENERAL REQUIREMENTS AND MEASURING METHODS (IEC 61169-1:2013)
    EN 60539-1:2016/AC:2017-09 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION (IEC 60539-1:2016/COR1:2017)
    EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    BS EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2
    BS EN 62435-5:2017 Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices
    EN 61811-1:2015 Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification
    EN 60862-1:2015 Surface acoustic wave (SAW) filters of assessed quality - Part 1: Generic specification
    EN 62739-1 : 2013 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING (IEC 62739-1:2013)
    I.S. EN 60384-26-1:2010 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26-1: BLANK DETAIL SPECIFICATION - FIXED ALUMINUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE - ASSESSMENT LEVEL EZ
    CEI EN 60115-2 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    CEI EN 60684-2 : 2012 FLEXIBLE INSULATING SLEEVING - PART 2: METHODS OF TEST
    CEI EN 140401 : 2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    CEI EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    BS EN 61020-1:2009 (published 2013-05) Electromechanical switches for use in electrical and electronic equipment Generic specification
    BS EN 62391-1:2016 Fixed electric double-layer capacitors for use in electric and electronic equipment Generic specification
    BS EN 60068-2-69:2017 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD (IEC 60068-2-69:2017)
    BS EN 62149-4:2010 Fibre optic active components and devices. Performance standards 1300 nm fibre optic transceivers for Gigabit Ethernet application
    BS EN 60127-6:2014 MINIATURE FUSES - PART 6: FUSE-HOLDERS FOR MINIATURE FUSE-LINKS
    CEI EN 60068-2-69 : 2008 ENVIRONMENTAL TESTING - PART 2-69: TESTS - TEST TE/TC: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS AND PRINTED BOARDS BY THE WETTING BALANCE (FORCE MEASUREMENT) METHOD
    CEI EN 60539-1 : 2009 DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION
    I.S. EN 60384-26:2010 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
    I.S. EN 61881-2:2012 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 2: ALUMINIUM ELECTROLYTIC CAPACITORS WITH NON SOLID ELECTROLYTE (IEC 61881-2:2012 (EQV))
    I.S. EN IEC 61076-3-119:2018 CONNECTORS FOR ELECTRICAL AND ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 3-119: RECTANGULAR CONNECTORS - DETAIL SPECIFICATION FOR SHIELDED AND UNSHIELDED, FREE AND FIXED 10-WAY CONNECTORS WITH PUSH-PULL COUPLING FOR INDUSTRIAL ENVIRONMENTS FOR DATA TRANSMISSION WITH FREQUENCIES UP TO 100 MHZ
    I.S. EN 60127-4:2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
    I.S. EN 60749-20:2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    I.S. EN 60862-1:2015 SURFACE ACOUSTIC WAVE (SAW) FILTERS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION
    I.S. EN 62149-9:2014 FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PERFORMANCE STANDARDS - PART 9: SEEDED REFLECTIVE SEMICONDUCTOR OPTICAL AMPLIFIER TRANSCEIVERS
    I.S. EN 61881-3:2012 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012 (EQV))
    I.S. EN 61811-1:2015 ELECTROMECHANICAL TELECOM ELEMENTARY RELAYS OF ASSESSED QUALITY - PART 1: GENERIC SPECIFICATION AND BLANK DETAIL SPECIFICATION
    CEI EN 60939-1 : 2011 PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - PART 1: GENERIC SPECIFICATION
    CEI EN 61760-3 : 2010 SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
    I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    EN 140401-803 : 2007 AMD 3 2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    EN 61747-10-1:2013 Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods – Mechanical
    EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
    EN 62149-4:2010 Fibre optic active components and devices - Performance standards - Part 4: 1 300 nm fibre optic transceivers for Gigabit Ethernet application
    EN 61643-311:2013 Components for low-voltage surge protective devices - Part 311: Performance requirements and test circuits for gas discharge tubes (GDT)
    EN 60115-8:2012 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
    EN 60127-2:2014 Miniature fuses - Part 2: Cartridge fuse-links
    EN 62246-1-1:2013 Reed switches - Part 1-1: Generic specification - Quality assessment
    EN 60252-2 : 2011 AMD 1 2013 AC MOTOR CAPACITORS - PART 2: MOTOR START CAPACITORS (IEC 60252-2:2010/A1:2013)
    EN 60068-2-83 : 2011 ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE (IEC 60068-2-83:2011)
    EN 61881-3:2012/A1:2013 RAILWAY APPLICATIONS - ROLLING STOCK EQUIPMENT - CAPACITORS FOR POWER ELECTRONICS - PART 3: ELECTRIC DOUBLE-LAYER CAPACITORS (IEC 61881-3:2012/A1:2013)
    EN 60115-8-1:2015 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)
    EN 62391-1:2016/AC:2016-12 FIXED ELECTRIC DOUBLE-LAYER CAPACITORS FOR USE IN ELECTRIC AND ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 62391-1:2015/COR1:2016)
    EN 60127-6:2014 Miniature fuses - Part 6: Fuse-holders for miniature fuse-links
    EN 60947-7-4 : 2013 LOW-VOLTAGE SWITCHGEAR AND CONTROLGEAR - PART 7-4: ANCILLARY EQUIPMENT - PCB TERMINAL BLOCKS FOR COPPER CONDUCTORS (IEC 60947-7-4:2013)
    EN 62149-9:2014 Fibre optic active components and devices - Performance standards - Part 9: Seeded reflective semiconductor optical amplifier transceivers
    EN 60384-26 : 2010 FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - PART 26: SECTIONAL SPECIFICATION - FIXED ALUMINIUM ELECTROLYTIC CAPACITORS WITH CONDUCTIVE POLYMER SOLID ELECTROLYTE
    EN 61020-1:2009 Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification
    EN 61643-312 : 2013 COMPONENTS FOR LOW-VOLTAGE SURGE PROTECTIVE DEVICES - PART 312: SELECTION AND APPLICATION PRINCIPLES FOR GAS DISCHARGE TUBES (IEC 61643-312:2013 + CORRIGENDUM JUL. 2013)

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    EN 60068-2-78:2013 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 60068-2-66:1994 Environmental testing - Part 2-66: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
    EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective