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  • BS EN 60191-6-5:2001

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for fine-pitchball grid array (FBGA)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  15-11-2001

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Definitions
    Annex ZA (normative) Normative references to international
              publications with their corresponding European
              publications

    Abstract - (Show below) - (Hide below)

    Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The aim of this design guide is to standardize outlines and secure interchangeability of FBGA packages.

    Scope - (Show below) - (Hide below)

    Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Also numbered as IEC 60191-6-5. (12/2001)
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
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