• DIN EN 60191-6-5:2002-05

    Current The latest, up-to-date edition.

    MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES; DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)

    Available format(s):  Hardcopy, PDF

    Language(s):  German

    Published date:  01-01-2002

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 Definitions
    Annex ZA (normative) Normative references to international
              publications with their corresponding European
              publications

    Abstract - (Show below) - (Hide below)

    Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The aim of this design guide is to standardize outlines and secure interchangeability of FBGA packages.

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    Development Note Supersedes DIN IEC 47D-195-CD. (05/2002)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current
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