NF EN 60191-6-5 : 2002

Current

Current The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-5: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR FINE-PITCH BALL GRID ARRAY (FBGA)

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Published date: 12-01-2013

Publisher: Association Francaise de Normalisation

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1 Scope
2 Normative references
3 Definitions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications

Abstract - (Show below) - (Hide below)

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The aim of this design guide is to standardize outlines and secure interchangeability of FBGA packages.

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Development Note	Indice de Classement: C96-013-6-5PR. (09/2002) PR NF EN 60191-6-5 January 2011. (02/2011)
Document Type	Standard
ISBN
Pages
Published
Publisher	Association Francaise de Normalisation
Status	Current

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
BS EN 60191-6-5:2001	Identical
UNE-EN 60191-6-5:2002	Identical
IEC 60191-6-5:2001	Identical
DIN EN 60191-6-5:2002-05	Identical
I.S. EN 60191-6-5:2002	Identical
EN 60191-6-5:2001	Identical

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