BS EN 60249-2-10:1994
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Specifications Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
Hardcopy , PDF
01-10-2006
English
01-06-2001
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Committees responsible
National foreword
Foreword
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material
after complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
quoted in this standard with the references of
the relevant European publications
In thickness of 0.7 mm up to 3.2 mm.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS 4584-102.10(1990). 1994 version incorporates amendment 8419 to BS 4584-102.10(1990). Also numbered as IEC 60249-2-10 Supersedes 89/22205 DC, 98/232805 DC & BS 4584-16(1978). (09/2005)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Withdrawn
|
| Supersedes |
| Standards | Relationship |
| EN 60249-2-10 : 1994 AMD 5 2000 | Identical |
| DIN EN 60249-2-10:2001-09 | Identical |
| I.S. EN 60249-2-10:1995 | Identical |
| SN EN 60249-2-10 : 1994 AMD 5 2000 | Identical |
| UNE-EN 60249-2-10:1996 | Identical |
| BS CECC 23100-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| BS EN 60249-1:1993 | Base materials for printed circuits Base materials for printed circuits. Test methods |
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