BS EN 60249-2-12:1994
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Specifications Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
Hardcopy , PDF
15-08-2006
English
15-07-2001
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Committees responsible
National foreword
Foreword
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad film
6 Non-electrical properties of the base material
after complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
quoted in this standard with the references of
the relevant European publications
Provides requirements for properties of thin epoxide woven glass fabric copper clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. These laminated sheets have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm (0.031 in). Materials may be used for single sided or double sided printed boards.
| Committee |
EPL/501
|
| DevelopmentNote |
Renumbers and supersedes BS 4584-102.12(1990). 1994 version incorporates amendment 8418 to BS 4584-102.12(1990). Supersedes BS 4584-12(1977), 89/22207 DC, 97/206325 DC & 98/232111 DC. Also numbered as IEC 60249-2-12. (09/2005)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| EN 60249-2-12 : 1994 AMD 4 2000 | Identical |
| I.S. EN 60249-2-12:1994 | Identical |
| SN EN 60249-2-12 : 1994 AMD 4 2000 | Identical |
| DIN EN 60249-2-12:2001-09 | Identical |
| UNE-EN 60249-2-12:1996 | Identical |
| BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123300-003:2001 | System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
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