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  • EN 60249-2-12 : 1994 AMD 4 2000

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS

    Available format(s): 

    Superseded date:  01-09-2005

    Language(s): 

    Published date:  12-01-2013

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    PREFACE
    1 Scope
    2 Materials and construction
    3 Internal marking
    4 Electrical properties
    5 Non-electrical properties of the copper-clad film
    6 Non-electrical properties of the base material after
      complete removal of the copper foil
    7 Packaging and marking
    8 Acceptance testing
    Annex ZA (normative) Other international publications
             quoted in this standard with the references of
             the relevant European publications

    Abstract - (Show below) - (Hide below)

    Provides requirements for properties of thin epoxide woven glass fabric copper clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. These laminated sheets have thicknesses (of the base laminate, excluding the copper foil) not greater than 0.8 mm (0.031 in). Materials may be used for single sided or double sided printed boards.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes HD 313.2.12 (06/2001)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
    IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
    EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
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