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  • EN 60249-2-8 : 1994 COR 1994

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 8: FLEXIBLE COPPER-CLAD POLYESTER (PETP) FILM

    Available format(s): 

    Withdrawn date:  31-01-2006

    Language(s): 

    Published date:  12-01-2013

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    PREFACE
    1 Scope
    2 Materials and construction
    3 Internal marking
    4 Electrical properties
    5 Non-electrical properties of the copper-clad film
    6 Non-electrical properties of the base material after
      complete removal of the copper foil
    7 Packaging and marking
    8 Acceptance testing
    9 Additional requirements
    Annex ZA (normative) Other international publications
             quoted in this standard with the references of
             the relevant European publications

    Abstract - (Show below) - (Hide below)

    Cette spécification donne les exigences concernant les propriétés des films flexibles de polyester (polyéthylène téréphtalate) (PETP) recouverts de cuivre.

    General Product Information - (Show below) - (Hide below)

    Committee SR 91
    Development Note Supersedes HD 313.2.8 (07/2005)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 61249-3-5:1999 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 3-5: SECTIONAL SPECIFICATION SET FOR UNREINFORCED BASE MATERIALS, CLAD AND UNCLAD (INTENDED FOR FLEXIBLE PRINTED BOARDS) - TRANSFER ADHESIVE FILMS
    EN 61249-3-5:1999 Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
    IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
    EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS
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