BS EN 60512-12-7:2001
Current
The latest, up-to-date edition.
Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Soldering tests Test 12g. Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method
Hardcopy , PDF
English
15-08-2001
1 Scope and object
2 Normative references
3 Preparation of the specimen
4 Procedure
5 Final measurement
6 Requirements
7 Details to be specified
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
Specifies a standard test method to access the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.
| Committee |
EPL/48
|
| DevelopmentNote |
Also numbered as IEC 60512-12-7. (08/2001) Supersedes 97/230402 DC (05/2005)
|
| DocumentType |
Standard
|
| Pages |
8
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
Defines a standard test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.
| Standards | Relationship |
| EN 60512-12-7:2001 | Identical |
| I.S. EN 60512-12-7:2001 | Identical |
| NF EN 60512-12-7 : 2002 | Identical |
| DIN EN 60512-12-7:2001-11 | Identical |
| UNE-EN 60512-12-7:2002 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| HD 323.2.54 : 200S1 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST TA: SOLDERING - SOLDERABILITY TESTING BY THE WETTING BALANCE METHOD |
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