BS EN 60603-12:1998
Current
The latest, up-to-date edition.
Connectors for frequencies below 3 MHz for use with printed boards Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
Hardcopy , PDF
English
15-05-1998
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 Scope
2 Normative references
3 IEC type designation
4 Common features
5 Dimensions
6 Characteristics
7 Test schedule
8 Dual-in-line sockets with solder termination for
through-board insertion (standard type)
9 Dual-in-line sockets with solderless wire wrapping
terminations for through-board insertion (standard type)
10 Dual-in-line sockets with solder terminations for
through-board insertion (low-profile type)
11 Dual-in-line sockets with solderless wire wrapping
terminations for through-board insertion (low-profile type)
12 Individual contact retention force gauge
13 Socket gauges
Annex ZA (normative) Normative references to international
publications with their corresponding European publications
Describes dimensions, general requirements and tests for a range of sockets designed to be used with integrated circuits in dual-in-line format. Covers standard and low-profile types. Does not apply to test/burn-in sockets.
| Committee |
EPL/48
|
| DevelopmentNote |
Also numbered as IEC 60603-12. (11/2005)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| NBN EN 60603-12 : 1998 | Identical |
| DIN EN 60603-12:1998-07 | Identical |
| NF EN 60603-12 : 1998 | Identical |
| SN EN 60603-12 : 1998 | Identical |
| EN 60603-12:1998 | Identical |
| IEC 60512-6:1984 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests |
| IEC 60468:1974 | Method of measurement of resistivity of metallic materials |
| IEC 60512-7:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests |
| IEC 60097:1991 | Grid systems for printed circuits |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60512-4:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests |
| IEC 60512-5:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests |
| IEC 60512-3:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests |
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