Skip to content
Please enter a keyword to search

  • BS EN 60603-12:1998

    Current The latest, up-to-date edition.

    Connectors for frequencies below 3 MHz for use with printed boards Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  15-05-1998

    Publisher:  British Standards Institution

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 IEC type designation
    4 Common features
    5 Dimensions
    6 Characteristics
    7 Test schedule
    8 Dual-in-line sockets with solder termination for
        through-board insertion (standard type)
    9 Dual-in-line sockets with solderless wire wrapping
        terminations for through-board insertion (standard type)
    10 Dual-in-line sockets with solder terminations for
        through-board insertion (low-profile type)
    11 Dual-in-line sockets with solderless wire wrapping
        terminations for through-board insertion (low-profile type)
    12 Individual contact retention force gauge
    13 Socket gauges
    Annex ZA (normative) Normative references to international
    publications with their corresponding European publications

    Abstract - (Show below) - (Hide below)

    Describes dimensions, general requirements and tests for a range of sockets designed to be used with integrated circuits in dual-in-line format. Covers standard and low-profile types. Does not apply to test/burn-in sockets.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/48
    Development Note Also numbered as IEC 60603-12. (11/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60512-6:1984 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests
    IEC 60468:1974 Method of measurement of resistivity of metallic materials
    IEC 60512-7:1993 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
    IEC 60097:1991 Grid systems for printed circuits
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60512-4:1976 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests
    IEC 60512-5:1992 Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests
    IEC 60512-3:1976 Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective