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SN EN 60603-12 : 1998

Current

Current

The latest, up-to-date edition.

CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 12: DETAIL SPECIFICATION FOR DIMENSIONS, GENERAL REQUIREMENTS AND TESTS FOR A RANGE OF SOCKETS DESIGNED FOR USE WITH INTEGRATED CIRCUITS

Published date

12-01-2013

1 Scope
2 Normative references
3 IEC type designation
4 Common features
5 Dimensions
6 Characteristics
7 Test schedule
8 Dual-in-line sockets with solder termination for
    through-board insertion (standard type)
9 Dual-in-line sockets with solderless wire wrapping
    terminations for through-board insertion (standard type)
10 Dual-in-line sockets with solder terminations for
    through-board insertion (low-profile type)
11 Dual-in-line sockets with solderless wire wrapping
    terminations for through-board insertion (low-profile type)
12 Individual contact retention force gauge
13 Socket gauges
Annex ZA (normative) Normative references to international
publications with their corresponding European publications

Describes dimensions, general requirements and tests for a range of sockets designed to be used with integrated circuits in dual-in-line format. Covers standard and low-profile types. Does not apply to test/burn-in sockets.

DocumentType
Standard
PublisherName
Swiss Standards
Status
Current

Standards Relationship
DIN EN 60603-12:1998-07 Identical
IEC 60603-12:1992 Identical
BS EN 60603-12:1998 Identical
EN 60603-12 : 1998 Identical

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