BS EN 60749-21:2011
Current
The latest, up-to-date edition.
Semiconductor devices. Mechanical and climatic test methods Solderability
Hardcopy , PDF
English
31-08-2011
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1 Scope
2 Normative references
3 Test apparatus
4 Procedure
5 Summary
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Constitutes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
| Committee |
EPL/47
|
| DevelopmentNote |
Partially supersedes BS EN 60749. (12/2005) Supersedes 01/208640 DC. (01/2006) Supersedes 09/30209670 DC. (09/2011)
|
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
This test method provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing.
This test is considered destructive unless otherwise detailed in the relevant specification.
NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors, the following text is applied.
NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20.
| Standards | Relationship |
| NBN EN 60749-21 : 2011 | Identical |
| DIN EN 60749-21:2012-01 | Identical |
| IEC 60749-21:2011 | Identical |
| EN 60749-21:2011 | Identical |
| I.S. EN 60749-21:2011 | Identical |
| NF EN 60749-21 : 2012 | Identical |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| EN 61190-1-2:2014 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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