BS EN 60749-22:2003

INTRODUCTION
1 Scope and object
  1.1 General description of the test
  1.2 Description of the test apparatus (for all methods)
2 Methods A and B (see also annex A)
  2.1 Scope
  2.2 General description of the test
3 Method C
  3.1 Scope
  3.2 Method C: Bond peel
4 Method D
  4.1 Scope
  4.2 Method D: Bond shear (applied to flip chip)
5 Methods E and F
  5.1 Scope
  5.2 Method E: Push-off test
  5.3 Method F: Pull-off test
  5.4 Failure criteria for both methods E and F:
  5.5 Force to be applied (both methods)
6 Method G: Wire ball shear test
  6.1 Scope
  6.2 General description
  6.3 Terms and definitions
  6.4 Equipment and material
  6.5 Procedure
  6.6 Acceptable test limits
7 Information to be given in the relevant specification
Annex A (normative) Guidance

Applies to semiconductor devices (discrete devices and integrated circuits). Measures bond strength or determine compliance with specified bond strength requirements.

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.