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BS EN 60749:1999

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

Semiconductor devices. Mechanical and climatic test methods

Available format(s)

Hardcopy , PDF

Superseded date

01-10-2005

Language(s)

English

Published date

23-09-2002

Chapter 1: General
1 Scope and object
2 Normative references
3 Terms, definitions and letter symbols
4 Standard atmospheric conditions
5 External visual examination and verification of dimensions
6 Electrical measurements
Chapter 2: Mechanical test methods
1 Robustness of terminations
   1.1 Tensile
   1.2 Bending
   1.3 Torsion
   1.4 Torque
2 Soldering
   2.1 Solderability
   2.2 Resistance to soldering heat
   2.3 Resistance of plastic encapsulated SMDs to the
        combined effect of moisture and soldering heat
3 Vibration (sinusoidal)
4 Shock
5 Acceleration, steady state
6 Bond strength test
   6.1 General
   6.2 Methods A and B
   6.3 Method C
   6.4 Method D
   6.5 Methods E and F
   6.6 Method G: Wire ball shear test
   6.7 Information to be given in the relevant specification
7 Die shear strength test
   7.1 Object
   7.2 Description of the test apparatus
   7.3 Test method
   7.4 Failure criteria
   7.5 Requirements
   7.6 Information to be given in the relevant
        specification
Chapter 3: Climatic Test Methods
1 Change of temperature
   1.1 Rapid change of temperature: two-chamber method
   1.2 Rapid change of temperature: two-fluid-bath method
2 Storage (at high temperature)
3 Low air pressure
4A Damp heat, steady state
4B Damp heat, steady state, accelerated
4C Damp heat, steady state, highly accelerated
5 Sealing
   5.1 General terms
   5.2 Bomb pressure test
   5.3 Fine leak detection: radioactive krypton method
   5.4 Fine leak detection: tracer gas method with mass spectrometer
   5.5 Gross leak, perfluorocarbon vapour method using electronic
        detection apparatus
   5.6 Gross leak - perfluorocarbon - bubble detection method
   5.7 Test condition E, weight-gain gross-leak detection
   5.8 Penetrant dye gross leak detection
   5.9 Gross leak re-tests
6 Salt mist
7 Thermal intermittence test
8 Internal moisture content measurement by mass
   spectrometry method
   8.1 Object
   8.2 General description
   8.3 Test apparatus
   8.4 Preconditioning
   8.5 Conditioning
   8.6 Requirements
   8.7 Information to be given in the relevant specification
   8.8 Guidance
Chapter 4: Miscellaneous Test Methods
1 Flammability tests of plastic-encapsulated devices
   1.1 Flammability (internally induced)
   1.2 Flammability (externally induced)
2 Permanence of marking
Annex A (normative) Guidance
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Uniform preferred test methods and values for stress levels for judging the environmental properties of semiconductor devices (discrete and integrated circuits) from which a selection may be made.

IEC 60653:1979 General considerations on ultrasonic cleaning
HD 323.2.11 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST KA: SALT MIST
HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
HD 323.2.13 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST M: LOW AIR PRESSURE
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60068-2-13:1983 Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
IEC 60068-2-11:1981 Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist
HD 323.2.14 : 200S2 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST N: OF TEMPERATURE
EN 60068-2-7:1993 Environmental testing - Part 2: Tests - Test Ga: Acceleration, steady state
HD 323.2.48 : 200S1 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - GUIDANCE ON THE APPLICATION OF THE TESTS OF IEC PUBLICATION 68 TO SIMULATE THE EFFECTS OF STORAGE
HD 323.2.3 : 200S2 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST CA - DAMP HEAT, STEADY STATE
IEC 60068-2-47:2005 Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests
IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
EN 60068-2-17:1994 Environmental testing - Part 2: Tests - Test Q: Sealing
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
EN 60068-2-6:2008 Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
IEC 60748-1:2002 Semiconductor devices - Integrated circuits - Part 1: General
IEC 60068-2-48:1982 Environmental testing - Part 2: Tests. Guidance on the application of the tests of IEC 68 to simulate the effects of storage
IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
EN 60695-2-2:1994/A1:1995 FIRE HAZARD TESTING - TEST METHODS - NEEDLE-FLAME TEST
EN 60068-2-47:2005 Environmental testing - Part 2-47: Tests - Mounting of specimens for vibration, impact and similar dynamic tests

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