BS EN 61188-5-3:2007
Current
The latest, up-to-date edition.
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on two sides
31-12-2007
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 TSOP (Type 1)
4.1 Field of application
4.2 Component description
4.3 Component dimensions
4.4 Solder joint fillet design
4.5 Land pattern dimensions
5 TSOP (Type 2)
5.1 Field of application
5.2 Component description
5.3 Component dimensions
5.4 Solder joint fillet design
5.5 Land pattern dimensions
6 SOP
6.1 Field of application
6.2 Component description
6.3 Component dimensions
6.4 Solder joint fillet design
6.5 Land pattern dimensions
7 SSOP
7.1 Field of application
7.2 Component description
7.3 Component dimensions
7.4 Solder joint fillet design
7.5 Land pattern dimensions
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Bibliography
Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 95/208506 DC & 95/208507 DC. (01/2008)
|
| DocumentType |
Standard
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 61188-5-3:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.
This publication is to be read in conjunction with IEC 61188-5-1 :2002.
| Standards | Relationship |
| EN 61188-5-3:2007 | Identical |
| DIN EN 61188-5-3:2008-07 | Identical |
| NF EN 61188-5-3 : 2016 | Identical |
| IEC 61188-5-3:2007 | Identical |
| I.S. EN 61188-5-3:2007 | Identical |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
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