BS EN 61188-5-4:2007

INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Packaging
  3.4 Process considerations
4 Small outlined J packages (SOJ)
  4.1 Component description
  4.2 Component dimensions
  4.3 Solder joint fillet design
  4.4 Land pattern dimensions
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications
Bibliography

Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process.

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with \'J\' leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.