IEC 61188-5-4:2007
Current
The latest, up-to-date edition.
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
Hardcopy , PDF
English, English - French
30-10-2007
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Packaging
3.4 Process considerations
4 Small outlined J packages (SOJ)
4.1 Component description
4.2 Component dimensions
4.3 Solder joint fillet design
4.4 Land pattern dimensions
Bibliography
IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
| Committee |
TC 91
|
| DevelopmentNote |
Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
15
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61188-5-4 : 2016 | Identical |
| GOST IEC 61188-5-4 : 2013 | Identical |
| NEN EN IEC 61188-5-4 : 2007 | Identical |
| I.S. EN 61188-5-4:2007 | Identical |
| PN EN 61188-5-4 : 2008 | Identical |
| BS EN 61188-5-4:2007 | Identical |
| CEI EN 61188-5-4 : 2008 | Identical |
| EN 61188-5-4:2007 | Identical |
| DIN EN 61188-5-4:2008-07 | Identical |
| UNE-EN 61188-5-4:2007 | Identical |
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