EN 61188-5-4:2007
Current
The latest, up-to-date edition.
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
23-11-2007
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Packaging
3.4 Process considerations
4 Small outlined J packages (SOJ)
4.1 Component description
4.2 Component dimensions
4.3 Solder joint fillet design
4.4 Land pattern dimensions
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Bibliography
Provides the component and land pattern dimensions for small outline integrated circuits with 'J' leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
| Committee |
CLC/SR 91
|
| DevelopmentNote |
To be read in conjunction with EN 61188-5-1. (12/2007)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61188-5-4 : 2016 | Identical |
| IEC 61188-5-4:2007 | Identical |
| NBN EN 61188-5-4 : 2008 | Identical |
| NEN EN IEC 61188-5-4 : 2007 | Identical |
| I.S. EN 61188-5-4:2007 | Identical |
| PN EN 61188-5-4 : 2008 | Identical |
| BS EN 61188-5-4:2007 | Identical |
| CEI EN 61188-5-4 : 2008 | Identical |
| DIN EN 61188-5-4:2008-07 | Identical |
| UNE-EN 61188-5-4:2007 | Identical |