BS EN 61188-5-5:2007
Current
The latest, up-to-date edition.
Printed boards and printed board assemblies. Design and use Attachment (land/joint) considerations. Components with gull- wing leads on four sides
31-12-2007
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 PQFP (square)
4.1 Field of application
4.2 Component descriptions
4.3 Component dimensions
4.4 Solder joint fillet design
4.5 Land pattern dimensions
5 PQFP (rectangular)
5.1 Field of application
5.2 Component descriptions
5.3 Component dimensions
5.4 Solder joint fillet design
5.5 Land pattern dimensions
6 PLQFP (square)
6.1 Field of application
6.2 Component descriptions
6.3 Component dimensions
6.4 Solder joint fillet design
6.5 Land pattern dimensions
7 PLQFP (rectangular)
7.1 Field of application
7.2 Component descriptions
7.3 Component dimensions
7.4 Solder joint fillet design
7.5 Land pattern dimensions
8 PTQFP (square)
8.1 Field of application
8.2 Component descriptions
8.3 Component dimensions
8.4 Solder joint fillet design
8.5 Land pattern dimensions
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 95/208509 DC. (01/2008)
|
| DocumentType |
Standard
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC 61188-5-5:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.
This publication is to be read in conjunction with IEC 61188-5-1 :2002.
| Standards | Relationship |
| IEC 61188-5-5:2007 | Identical |
| I.S. EN 61188-5-5:2007 | Identical |
| NF EN 61188-5-5 : 2016 | Identical |
| EN 61188-5-5:2007 | Identical |
| DIN EN 61188-5-5:2008-07 | Identical |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| EN 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
| EN 61191-1:2013 | PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
| EN 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
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