BS EN 61188-5-6:2003
Current
The latest, up-to-date edition.
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Chip carriers with J-leads on four sides
Hardcopy , PDF
English
26-06-2003
INTRODUCTION
1 Scope and object
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 QFJ (square)
4.1 Introductory remark
4.2 Component description
4.3 Component dimensions
4.4 Solder joint fillet design
4.5 Land pattern dimensions
5 QFJ (rectangular)
5.1 Introductory remark
5.2 Component description
5.3 Component dimensions
5.4 Solder joint fillet design
5.5 Land pattern dimensions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Figures
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