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BS EN 61249-4-5:2005

Current

Current

The latest, up-to-date edition.

Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-02-2006

€156.59
Excluding VAT

1 Scope
2 Normative references
3 Materials and construction
  3.1 Reinforcement
  3.2 Resin system
4 Properties
  4.1 Properties related to the appearance of
      the prepreg
  4.2 Properties related to B-stage prepreg
  4.3 Properties related to prepreg after curing
5 Delivery form
  5.1 Rolls
  5.2 Sheets
  5.3 Cut panels
6 Quality assurance
  6.1 Quality system
  6.2 Responsibility for inspection
  6.3 Qualification inspection
  6.4 Quality conformance inspection
  6.5 Certificate of conformance
  6.6 Safety data sheet
7 Packaging and marking
8 Shelf life
9 Ordering information
Bibliography
Annex ZA (normative) Normative references to international
                     publications with their corresponding
                     European publications

Provides requirements for properties of prepreg that is mainly proposed to be used as bonding sheets in connection with laminates according IEC 61249-2-11 when manufacturing multilayer boards according to IEC 62326-4.

Committee
EPL/501
DevelopmentNote
Supersedes 02/211158 DC. (02/2006)
DocumentType
Standard
Pages
16
PublisherName
British Standards Institution
Status
Current
Supersedes

This part of IEC 61249 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-8 when manufacturing multilayer boards according to IEC 62326-4. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of brominated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier\'s instructions, the glass transition temperature is defined as 150 °C minimum.

Standards Relationship
NF EN 61249-4-5 : 2006 Identical
I.S. EN 61249-4-5:2005 Identical
EN 61249-4-5:2005 Identical
SN EN 61249-4-5 : 2005 Identical
DIN EN 61249-4-5:2006-03 Identical
IEC 61249-4-5:2005 Identical
NBN EN 61249-4-5 : 2007 Identical

EN 61249-2-11:2003/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-11: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - POLYIMIDE, BROMINATED EPOXIDE MODIFIED OR UNMODIFIED, WOVEN E-GLASS REINFORCED LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
IEC 61249-2-11:2003 Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
ISO 11014-1:1994 Safety data sheet for chemical products Part 1: Content and order of sections
IEC 62326-4:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
ISO 14001:2015 Environmental management systems — Requirements with guidance for use
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN ISO 14001:2015 Environmental management systems - Requirements with guidance for use (ISO 14001:2015)
ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
EN 62326-4:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
EN ISO 9000:2015 Quality management systems - Fundamentals and vocabulary (ISO 9000:2015)
EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

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