Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-09-2011

Publisher

British Standards Institution

FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Error estimation using
        finite element method
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Describes micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.

Committee	EPL/47
DevelopmentNote	Supersedes 10/30211442 DC. (09/2011)
DocumentType	Standard
Pages	18
PublisherName	British Standards Institution
Status	Current
Supersedes	10/30211442 DC : 0

This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.

The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro-machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.

Standards	Relationship
EN 62047-10 : 2011	Identical

ASTM E 9 : 2009	Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature
IEC 62047-8:2011	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
EN 62047-8:2011	Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

View more information

€155.16

Excluding VAT

Product format

I agree to the DRM document license rules apply against the PDF selection made.

Please confirm that you agree to the document license rules for this document.

I agree to the document license rules .

Please confirm that you agree to the document license rules for this document.

Access your standards online with a subscription

Features

Simple online access to standards, technical information and regulations.
Critical updates of standards and customisable alerts and notifications.
Multi-user online standards collection: secure, flexible and cost effective.

Get in touch with us

BS EN 62047-10:2011

Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials

Table of Contents

Abstract

General Product Information

Scope

International Equivalents

Standards Referencing This Book

Category

Subcategory