BS EN 62047-10:2011
Current
The latest, up-to-date edition.
Semiconductor devices. Micro-electromechanical devices Micro-pillar compression test for MEMS materials
Hardcopy , PDF
English
30-09-2011
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FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex A (informative) - Error estimation using
finite element method
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 10/30211442 DC. (09/2011)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 62047 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained.
The test piece is a cylindrical pillar fabricated on a rigid (or highly stiff) substrate by micro-machining technologies, and its aspect ratio (ratio of pillar diameter to pillar height) should be more than 3. This standard is applicable to metallic, ceramic, and polymeric materials.
| Standards | Relationship |
| EN 62047-10 : 2011 | Identical |
| IEC 62047-10:2011 | Identical |
| ASTM E 9 : 2009 | Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature |
| IEC 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| EN 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
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