• IEC 62047-10:2011

    Current The latest, up-to-date edition.

    Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s): 

    Published date:  26-07-2011

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Symbols and designations
    4 Test piece
    5 Testing method and test apparatus
    6 Test report
    Annex A (informative) - Error estimation using finite
                            element method
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    ASTM E 9 : 2009 Standard Test Methods of Compression Testing of Metallic Materials at Room Temperature
    IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
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