BS EN 62047-12:2011
Current
The latest, up-to-date edition.
Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
Hardcopy , PDF
English
30-11-2011
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Specimen
6 Test conditions
7 Initial measurement
8 Test
9 Test report
Annex A (informative) - Example of testing using an
electrostatic device with an integrated actuation
component and displacement detection component
Annex B (informative) - Example of testing using an external
drive and a device with an integrated strain gauge
for detecting displacement
Annex C (informative) - Example of electromagnetic drive
out-of-plane vibration test (external drive
vibration test)
Annex D (informative) - Theoretical expression on fatigue
life of brittle materials based on Paris' law
and Weibull distribution
Annex E (informative) - Analysis examples
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Describes a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines.
Committee |
EPL/47
|
DevelopmentNote |
Supersedes 10/30205425 DC. (11/2011)
|
DocumentType |
Standard
|
Pages |
34
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro-electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 µm to 1 000 µm in the plane direction and from 1 µm to 100 µm in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 µm and 10 µm in thickness.
The main structural materials for MEMS, micromachine, etc. have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. The MEMS structures often have higher fundamental resonant frequency and higher strength than macro structures. To evaluate and assure the lifetime of MEMS structures, a fatigue testing method with ultra high cycles (up to 1012) loadings needs to be established. The object of the test method is to evaluate the mechanical fatigue properties of microscale materials in a short time by applying high load and high cyclic frequency bending stress using resonant vibration.
Standards | Relationship |
EN 62047-12 : 2011 | Identical |
IEC 62047-12:2011 | Identical |
IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
IEC 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing |
EN 62047-3 : 2006 | SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING |
ISO 12107:2012 | Metallic materials — Fatigue testing — Statistical planning and analysis of data |
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