BS EN 62047-18:2013

1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method
6 Test report
Annex A (informative) - Precautions for the test
        piece/substrate interface
Annex B (informative) - Precautions necessary for the force
        displacement relationship
Annex ZA (normative) - Normative references to international
         publications with their corresponding
         European publications

Describes the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 [mu]m and 10 [mu]m.

This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 µm and 10 µm. Thin films are used as main structural materials for Micro-electromechanical Systems (abbreviated as MEMS in this document) and micromachines.

The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material fabrication by deposition, photolithography, and/ or non-mechanical machining test piece. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.