BS EN 62047-2:2006

1 Scope
2 Normative references
3 Symbols and designations
4 Testing method and test apparatus
  4.1 Method of gripping
  4.2 Method of loading
  4.3 Speed of testing
  4.4 Force measurement
  4.5 Elongation measurement
  4.6 Stress-strain curve
  4.7 Environment control
5 Test piece
  5.1 General
  5.2 Plane shape of test piece
  5.3 Test piece thickness
  5.4 Gauge mark
6 Test report
Annex A (informative) Test piece grip methods
Annex B (normative) Testing conditions
Annex C (informative) Test piece
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10[mu]m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices.

Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.