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  • BS EN 62374-1:2010

    Current The latest, up-to-date edition.

    Semiconductor devices Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  30-06-2011

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Terms and definitions
    3 Test equipment
    4 Test samples
    5 Procedures
    6 Lifetime estimation
    7 Lifetime dependence on inter-metal layer area
    8 Summary
    Annex A (informative) - Engineering supplementation for
            lifetime estimation
    Bibliography

    Abstract - (Show below) - (Hide below)

    Specifies a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

    Scope - (Show below) - (Hide below)

    This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes 07/30171395 DC. (12/2010) Earlier supersedes BS EN 62374 in error by publisher, now has been re-instated. (06/2011)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes
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