BS EN IEC 61190-1-3:2018
Current
The latest, up-to-date edition.
Attachment materials for electronic assembly Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Hardcopy , PDF
English
28-03-2018
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
EPL/501
|
| DocumentType |
Standard
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| Pages |
50
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| PublisherName |
British Standards Institution
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| Status |
Current
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| Supersedes |
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for \'special\' electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material\'s performance in the manufacturing process.
Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.
| Standards | Relationship |
| IEC 61190-1-3:2017 | Identical |
| EN 60076-1:2011 | Identical |
| EN IEC 61190-1-3:2018 | Identical |
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