BS EN ISO 9455-10:2012
Current
The latest, up-to-date edition.
Soft soldering fluxes. Test methods Flux efficacy test, solder spread method
Hardcopy , PDF
English
30-11-2012
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
1 Scope
2 Normative references
3 Symbols
4 Principle
5 Reagents
6 Apparatus and materials
7 Test specimens
8 Procedure
9 Expression of results
10 Precision
11 Test report
Annex A (informative) - Method for the preparation of
standard reference rosin (colophony) based
liquid fluxes, having 25% by mass non-volatile
content
Annex B (informative) - Chemical composition of brass
test plates
Bibliography
Defines a method for the determination of the efficacy of a soft soldering flux.
| Committee |
EPL/501
|
| DevelopmentNote |
Supersedes 97/701906 DC Together with BS EN ISO 9454-2, BS EN ISO 9455-6, BS EN ISO 9455-13, BS EN ISO 9455-15, BS EN 29454-1 and BS EN 29455-1, supersedes BS 5625(1980) (09/2001) Supersedes 11/30234673 DC. (11/2012)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of ISO 9455 specifies a method for the determination of the efficacy of a soft soldering flux. The method is known as the solder spread method of filler metal and is applicable to all flux classes defined in ISO 9454-1.
NOTE An alternative method for the determination of the flux efficacy, applicable to liquid fluxes only, known as the wetting balance method, is specified in ISO 9455-16.[3]
| Standards | Relationship |
| SN EN ISO 9455-10 : 2012 | Identical |
| UNI EN ISO 9455-10 : 2012 | Identical |
| I.S. EN ISO 9455-10:2012 | Identical |
| NF EN ISO 9455-10 : 2012 | Identical |
| NS EN ISO 9455-10 : 2012 | Identical |
| ISO 9455-10:2012 | Identical |
| NEN EN ISO 9455-10 : 2012 | Identical |
| DIN EN ISO 9455-10:2013-01 | Identical |
| UNE-EN ISO 9455-10:2012 | Identical |
| NBN EN ISO 9455-10 : 2012 | Identical |
| EN ISO 9455-10:2012 | Identical |
| ISO 197-1:1983 | Copper and copper alloys — Terms and definitions — Part 1: Materials |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| ISO 9454-1:2016 | Soft soldering fluxes Classification and requirements Part 1: Classification, labelling and packaging |
| IEC 60068-2-54:2006 | Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
| ISO 9455-16:2013 | Soft soldering fluxes Test methods Part 16: Flux efficacy test, wetting balance method |
| ISO 3611:2010 | Geometrical product specifications (GPS) — Dimensional measuring equipment: Micrometers for external measurements — Design and metrological characteristics |
| ISO 9453:2014 | Soft solder alloys Chemical compositions and forms |
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