BS IEC 60748-23-3:2002
Current
The latest, up-to-date edition.
Semiconductor devices. Integrated circuits. Hybrid integrated circuits and film structures. Manufacturing line certification Manufacturers\' self-audit checklist and report
Hardcopy , PDF
English
18-06-2002
Committee |
EPL/47
|
DevelopmentNote |
Supersedes 94/216400 DC (07/2002)
|
DocumentType |
Standard
|
Pages |
88
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
Applies to a high quality approval system for hybrid integrated circuits and film structures.This checklist is intended for the use of a hybrid microcircuit manufacturer\'s internal assessment team. It will provide the hybrid manufacturer and the National Supervising Inspectorate with ongoing information on process control demonstrating compliance with IEC 60748-23-1.
Standards | Relationship |
IEC 60748-23-3:2002 | Identical |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IECQ 001002-3:2005 | IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES |
IEC 60748-23-1:2002 | Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification |
IEC 60748-23-4:2002 | Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification |
IEC 60748-1:2002 | Semiconductor devices - Integrated circuits - Part 1: General |
IEC 60748-23-2:2002 | Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests |
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