• BS IEC 63055:2016

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Format for LSI-Package-Board interoperable design

    Available format(s):  Hardcopy, PDF

    Superseded date:  08-11-2023

    Language(s):  English

    Published date:  30-11-2016

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Overview
    2 Normative references
    3 Definitions, acronyms, and abbreviations
    4 Concept of the LPB Format
    5 Language basics
    6 Common elements in M-Format, C-Format,
       and R-Format
    7 M-Format
    8 C-Format
    9 R-Format
    10 N-Format
    11 G-Format
    Annex A (informative) - Bibliography
    Annex B (informative) - Examples of utilization
    Annex C (informative) - XML Encryption
    Annex D (informative) - MD5 checksum
    Annex E (informative) - Chip-Package Interface Protocol
    Annex F (informative) - IEEE list of participants

    Abstract - (Show below) - (Hide below)

    Specifies a common interoperable format that will be used for the design of: a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected.

    Scope - (Show below) - (Hide below)

    This standard defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as?? LSI-Package-Board?? (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Document Type Standard
    Publisher British Standards Institution
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEEE 1364-2005 IEEE Standard for Verilog Hardware Description Language
    IEC 62433-2:2017 EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
    IEC 62433-4:2016 EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
    IEEE 1076-2008 REDLINE IEEE Standard VHDL Language Reference Manual
    IEC 62433-3:2017 EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
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