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  • IEC 63055:2016

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Format for LSI-Package-Board Interoperable design

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  11-10-2023

    Language(s):  English

    Published date:  08-11-2016

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
    a) large-scale integration (LSI),
    b) packages for such LSI, and
    c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Also numbered as IEEE 2401. Stability Date: 2021. (11/2016)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEEE 1364-2005 IEEE Standard for Verilog Hardware Description Language
    IEC 62433-2:2017 EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
    IEC 62433-4:2016 EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)
    IEEE 1076-2008 REDLINE IEEE Standard VHDL Language Reference Manual
    IEC 62433-3:2017 EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
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