Committees responsible
National foreword
Specification
1. Scope and object
1.1 Scope
1.2 Object
2. General, preferred characteristics, ratings and
severities for environmental, including mechanical
tests
2.1 Related documents
2.2 Preferred ratings and characteristics
2.3 Information to be given in a detail specification
3. Capability approval procedures
3.1 Selection of capability qualifying circuits (CQCs)
3.2 Structural similarity
3.3 Capability approval
3.4 Resubmission of rejected lots (lot-by-lot
inspection)
3.5 Manufacturing stages in a factor of an approved
manufacturer in a non-IEC member country
4. Test and measurement procedures
Appendices
A. Structural similarity rules for capability approval
B. Minimum contents of a manufacturer's capability
manual for thick film circuits
C. Minimum contents of a manufacturer's capability
manual for thin film circuits
Tables
1. Test schedule for qualification approval
2. Assessment levels and acceptance criteria for
initial capability approval
3. Assessment levels and acceptance criteria for
quality conformance inspection
4. Screening
A.1 Classification of technology, materials and
processes
A.2 Substrates
A.3 Film materials
A.4 Added non-encapsulated active chip components
A.5 Added encapsulated active components other than
chips
A.6 Added passive components
A.7 Package
A.8 Mass and dimensions of package
A.9 Limits of association in relation with mass and
dimensions
A.10 Combination criteria for environmental, including
mechanical, testing