BS QC 760201:1997
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
Hardcopy , PDF
English
15-08-1997
INTRODUCTION
1 Characteristics and conditions of use
2 Recommended methods of mounting
3 Marking
4 Ordering information
5 Certified records of released lots
6 Additional information
7 Additional or increased severities of requirements
to those specified in the generic and/or
sectional specification
8 Inspection requirements (see tables 2 and 3 or 4 and 5)
9 Supplement - Tables of method B
Tables
1 Where a range of circuits
2 Method A - Groups A and B - Lot-by-lot
3a Method A - Group C - Periodic tests
3b Method A - Group D - Periodic tests
4a Method B - Group A - Lot-by-lot
4b Method B - Group B - Lot-by-lot
5a Method B - Group C - Periodic tests
5b Method B - Group D - Periodic tests
Committee |
EH/4
|
DevelopmentNote |
Supersedes BS QC760201(1992) and 95/200683 DC. Also numbered as IEC 60748-22-1. To be read in conjunction with BS QC 760000(1990) and BS QC 760200(1997) (09/2003)
|
DocumentType |
Standard
|
Pages |
20
|
PublisherName |
British Standards Institution
|
Status |
Current
|
Supersedes |
BS QC 760000:1990 | Harmonized system of quality assessment for electronic components. Film and hybrid film integrated circuits. Generic specification |
IEC 60748-22:1997 | Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
IEC 60748-20-1:1994 | Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination |
BS QC 760200:1992 | Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approval |
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