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  • CECC 00107(PT2) : 79 AMD 1

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR ENHANCED ASSESSMENT OF QUALITY

    Available format(s): 

    Superseded date:  23-07-2013

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Cenelec Electronic Components Committee

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    Document Type Standard
    Publisher Cenelec Electronic Components Committee
    Status Superseded

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 117000:1997 Harmonized system of quality assessment for electronic components. Generic specification. Solid state all-or-nothing relays. Generic data and methods of test
    BS EN 114000:1993 Harmonized system of quality assessment for electronic components: generic specification: photomultiplier tubes
    BS EN 135000:1993 Harmonized system of quality assessment for electronic components. Generic specification: travelling wave amplifier tubes
    BS CECC 00114-1:1991 Rule of procedure 14. Quality assessment procedures Approval of manufacturers and other organizations
    BS CECC 63000:1990 Harmonized system of quality assessment for electronic components. Generic specification: film and hybrid integrated circuits
    BS EN 123100:1992 Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes
    BS EN 136000:1993 Harmonized system of quality assessment for electronic components: generic specification: magnetrons
    BS CECC 16101:1980 Specification for harmonized system of quality assessment for electronic components. Blank detail specification. Electromechanical all-or-nothing relays. Test schedule 3
    BS CECC 00114-4:1992 Rule of procedure 14. Quality assessment procedures Procedure for enhanced assessment of quality
    BS EN 123300:1992 Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
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